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CAS NO.28804-46-8
|
Product Name: |
Dichlorodi-p-xylylene |
|
Synonyms: |
5,11-dichlorotricyclo[8.2.2.24,7]hexadeca-4,6,10,12,13,15-hexaene;6,12-Dichlorobis(p-xylylene);DICHLORO-[2,2]-PARACYCLOPHANE;Dichlorodi-p-xylylene;Parylene C ,92%;Dichlorodi-p-xylylen;Dichlorodi-1,4-xylylene;Dichloro-[2,2]-paracyclophane (Parylene C) |
|
CAS: |
28804-46-8 |
|
MF: |
C16H14Cl2 |
|
MW: |
277.193 |
Properties
|
Melting point |
165-167 ºC |
|
density |
0.671[at 20℃] |
|
vapor pressure |
0.002Pa at 25℃ |
|
Water Solubility |
230μg/L at 20℃ |
Feature and advantages:
Parylene C films have numerous advantages.
The versatility of parylene C coatings makes them useful in a broad range of biomedical applications.
The coatings are widely used commercially because of the unique combination of their physicochemical properties, i.e. flexibility and dielectricity. The chemical vapour deposition process enables parylene C conformal coatings to be applied to even the most complex medical devices. The coatings can be customised for the desired application using surface modification methods, which alter surface chemistry and topography. In this review, we summarise the last ten years (2008–2018) of research on parylene C for biomedical applications. We discuss how parylene C properties can be modulated through surface and bulk modifications to improve its key functions, i.e. anticorrosive, biocompatible, anti-infection, and therapeutic functions. We emphasise current and potential biomedical applications and finally highlight the advantages and limitations of the coatings, pointing out the perspectives and the most promising research trends.
• Parylene C is the most popular type because it provides a combination of barrier and dielectric properties while also having cost and processing advantages.
• Parylene C has a chlorine atom on one of the aromatic hydrogens. This gives parylene C very low permeability for better protection from moisture, chemicals and corrosive gases.
• Parylene C deposits much faster than other types which allow a thicker layer to be applied with less machine time.